ISPIM Innovation Conference: Call for Submissions

Call for Submissions

The 2024 ISPIM Innovation Conference, “Local Innovation Ecosystems for Global Impact”, is a three-day event that brings together world-renowned experts on innovation management. Researchers, managers, business and thought leaders will share insights on innovation management hot-topics.

ISPIM and our partners, TalTech - Tallinn University of Technology and The Estonian Design Centre, encourage examples and insights into successful innovation practice, challenges or research from all regions of the world. If you are in doubt, please discuss your idea with an email to admin@ispim.org.

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LOCAL FOCUS THEMES

You are invited to share insights on the following topics or other challenges and to demonstrate approaches, solutions, and best practices:

Aging and Innovation
Baltic and Nordic Innovation Collaboration
Cybersecurity, Social and Technological Resilience
Data-driven Decision Making
Design and Design Thinking for Innovation
E-Governance and Digital Society
Innovation Policy and Regulatory Frameworks
Smart Cities and Urban Innovation
Social, Technical and Regulatory Testbeds for Innovation

Tallinn’s innovation scene, is a dynamic blend of historical charm and forward-looking creativity. Known as the birthplace of Skype and a trailblazer in e-governance, the city fosters a thriving ecosystem that nurtures start-ups, tech giants like Wise and the smart city of Ülemiste City.

Supported by favourable policies, robust infrastructure, and education, Tallinn fuels a continuous cycle of cutting-edge ideas. From fintech to AI, the city boasts a diverse range of innovation sectors. Its innovation ecosystem is a fertile ground for innovators, entrepreneurs, and researchers, with companies like Bolt and Skeleton Technologies making their mark.

Tallinn’s unique blend of history, culture, and technology creates an environment where innovation flourishes, contributing to its global impact and reputation as a hub for dynamic creativity.

GENERAL THEMES

AI and Innovation (including Big Data)
Business Models
Circular Innovation (SIG)*
Creativity in Innovation
Digital Disruption & Digital Transformation (SIG)*
Entrepreneurship & Innovation in Start-Ups & SMEs
Futures & Foresight (SIG)*
Gender & Innovation Management
Health, Healthcare & Innovation Management (SIG)*
Innovation for Fintech
Innovation Leadership & Organisational Culture (SIG)*

Innovation Management Systems, Standards & Certification (SIG)*
Innovation Policies & Instruments
Innovation Training, Teaching & Coaching (SIG)*
Knowledge & Technology Transfer for Innovation
Living Labs (SIG)*
Methods & Skills for Innovation Management Research
Open Innovation
Platforms, Ecosystems and Supply Chains
Responsible Innovation (SIG)*
Values-based & Sustainability-Oriented Innovation Management (SIG)*

* Special Interest Group

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Submission Deadlines

2 February 2024: Outlines Only (All Submissions)
3 March 2024: Acceptance Notification
3 May 2024: Final Submissions (including papers & photos) PLUS registration & receipt of payment
31 May 2024: Presentation Slides

Early submission and acceptance notification is possible for all authors with external funding application deadlines.

Contact admin@ispim.org.

Proceedings

Accepted submissions will be scheduled for presentation in the conference programme in thematic sessions. Papers will be published in the Conference Proceedings with an ISBN and included online in EBSCOhost and ProQuest. Authors may withhold their papers from the proceedings on request.

Leading papers will form a Special Issue in International Journal of Innovation Management (General Topics). Selected leading papers will also be entered, where suitable, for consideration by associated journals: Creativity and Innovation Management; Futures & Foresight Science; Information Systems Journal; International Journal of Entrepreneurship and Innovation Management; International Journal of Innovation Management; Prometheus: Critical Studies in Innovation; R&D Management; Technological Forecasting and Social Change; Technovation; World Patent Information.